摘要

A novel compensation technique for bonding-wire interconnection based on single-objective optimization is proposed in this paper. The optimization method is based on the analytical expressions, which contributes to efficient construction of compensation structure in the given area. The resulting design can achieve large bandwidth, from DC to 120 GHz with a return loss of 15 dB. The traditional compensation methods, such as the quarter-wave transformer and the Klopfenstein tapered line, are also discussed and compared in this paper. In addition, the tolerances to deviations in design, including boding-wire and the substrate etching geometry, are verified to demonstrate the robustness of the proposed structure.