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摘要
This paper develops a multi function a I test chip for property extractions on packaging design. Components on this test chip include the diodes as the temperature sensors; the polysilicon units as the heaters; the piezoresistors as the stress sensors; and the pads as well as the related metal connector designs for the electrical parameter extractions. To save the sensor numbers and the connecting wires, sensors on the test chip surface were put according to structure symmetry. Since each packaging design has its individual size, components on the test chip surface were laid based on assembly of small unit cells, so that flexible test chip size can be obtained to fit the requirements from different packaging dimensions. The inductance and capacitance for the packaging leads were also extracted under microwave frequency operations, and a testing Fixture was built to cooperate the Quad Flat Package (QFP) samples with the RF-RLC meter. The availability of the new measurement system designs was demonstrated from the testing data.
- 出版日期2007-8
- 单位中国人民解放军国防大学
