An atomic layer deposition process for moving flexible substrates

作者：Maydannik P S^*; Kaariainen T O; Cameron D C

来源：Chemical Engineering Journal, 2011, 171(1): 345-349.

DOI：10.1016/j.cej.2011.03.097

• Atomic layer deposition
• Flexible substrate
• Aluminium oxide

A new design of atomic layer deposition (ALD) system for deposition on to moving flexible substrates has been demonstrated. The basic design is a cylindrical drum to which the substrate is attached which rotates inside a reaction chamber fitted with a number of different precursor and purge zones. It is intended as a vehicle for determining the parameters which are important in the design of a roll-to-roll ALD system. The system shows that deposition takes place according to the typical ALD model where there is dose saturation above a certain dose levels and that the thickness of film deposited is proportional to the number of ALD cycles carried out. The deposition rate for a reaction temperature of 100 degrees C is similar to 1 angstrom/cycle. Good uniformity across the width of a 300 mm x 100 mm flexible substrate is demonstrated. The deposition process shows some deviations from classical ALD behaviour which can be understood taking into account the movement of the substrate.

• 出版日期2011-6-15