Diode laser soldering using a lead-free tiller material for electronic packaging structures

作者：Chaminade C^*; Fogarassy E; Boisselier D

来源：Applied Surface Science, 2006, 252(13): 4406-4410.

DOI：10.1016/j.apsusc.2005.07.095

• laser
• soldering
• lead-free
• thermal modelling
• electronic packaging

As of today, several lead-free soldering pastes have been qualified for currently used soldering process. Regarding the new potential of laser-assisted soldering processes, the behaviour of the SnAgCu soldering paste requires, however, new investigations. In the first part of this study, the specific temperature profile of a laser soldering process is investigated using a high power diode laser (HPDL). These experimental results are compared to a thermal simulation developed for this specific application. The second part of this work deals with the diffusion of the tin-based filler material through the nickel barrier using the information extracted from the temperature simulations.

• 出版日期2006-4-30