Modeling of an oblique impact of solder droplet onto a groove with the impact point to be offset from the groove surfaces interface

作者：Tian Dewen^*; Tian Yanhong; Wang Chunqing; Hang Chunjin

来源：Journal of Materials Science, 2009, 44(7): 1772-1779.

DOI：10.1007/s10853-009-3253-x

• Energy variations
• High speed videography
• Impact dynamics
• Impact point
• Molten solders
• Oblique impact
• Simulated results
• Wall shear stress

A three-dimensional VOF model has been developed to predict the oblique impact of a molten solder droplet onto a groove with the impact point to be offset from the groove surfaces interface. The contact angle boundary condition and the surface tension are considered in the present model. High speed videography system is used to record the impact dynamics. Asymmetric solder deformation is observed during the impact of the solder droplet onto the groove. The simulated results are in good agreement with the experiment. The presented model can accurately predict the characteristic geometry of the solder droplet, the interaction between the gas and the solder, the wall shear stress acting on the pads, and the energy variations during the impingement.

• 出版日期2009-4
• 单位哈尔滨工业大学