Mechanical properties of nano-silver joints as die attach materials

作者：Siow Kim S^*

来源：Journal of Alloys and Compounds, 2012, 514: 6-19.

DOI：10.1016/j.jallcom.2011.10.092

• Mechanical properties
• Sintering
• Ag nanoparticles
• Lead free die attach

This review traces the development of silver (Ag) as a die attach bonding material in the microelectronic packaging industry from its' early days as micron-scale silver flakes to the recent nanoscale Ag paste and other derivatives. Basic materials properties include the composition of Ag pastes, the methods of producing Ag nanoparticles, and product applications will be presented. Key processing conditions will be discussed to elucidate different factors which influence the mechanical properties of nano-Ag joints, principally the tensile and shear strength as well as thermal fatigue properties. Success in implementing nano-scale Ag pastes could only have been possible by deriving a fundamental understanding developed in the field of processing and using ceramic and metallic nano-powders.

• 出版日期2012-2-15