科研之友
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摘要
An Sn-Ag-Cu based solder alloy, including Ni, Bi and Sb additives, is investigated in this study under isothermal aging conditions. Shear creep tests are conducted on different aged solder joints with copper substrate, giving the creep resistance evolution with aging time. Microscopy analyses reveal the limited growth of the Cu-rich inter-metallic layer due to the Ni content and allow for determination of the time-dependent growth of the Sn-rich inter-metallic layer. The aged specimens also exhibit a partial dynamically recrystallized microstructure after creep deformation and a brittle-to-ductile fracture transition is found with occurrence of intergranular cracking in the joint.
- 出版日期2018-1
