Advances in High-Density Inter-Chip Interconnects with Photonic Wiring

作者：Urino Yutaka; Noguchi Yoshiji; Hatori Nobuaki; Ishizaka Masashige; Usuki Tatsuya; Fujikata Junichi; Yamada Koji; Horikawa Tsuyoshi; Nakamura Takahiro; Arakawa Yasuhiko

来源：IEICE - Transactions on Electronics, 2013, E96C(7): 958-965.

DOI：10.1587/transele.E96.C.958

• integrated optics
• integrated optoelectronics
• optical devices
• optical interconnections

One of the most serious challenges facing the exponential performance growth in the information industry is a bandwidth bottleneck in inter-chip interconnects. We therefore propose a photonics-electronics convergence system with a silicon optical interposer. We examined integration between photonics and electronics and integration between light sources and silicon substrates, and we fabricated a conceptual model of the proposed system based on the results of those examinations. We also investigated the configurations and characteristics of optical components for the silicon optical interposer: silicon optical waveguides, silicon optical splitters, silicon optical modulators, germanium photodetectors, arrayed laser diodes, and spot-size converters. We then demonstrated the feasibility of the system by fabricating a high-density optical interposer by using silicon photonics integrated with these optical components on a single silicon substrate. As a result, we achieved error-free data transmission at 12.5 Gbps and a high bandwidth density of 6.6 Tbps/cm(2) with the optical interposer. We think that this technology will solve the bandwidth bottleneck problem.

• 出版日期2013-7