摘要

Atomic layer deposition (ALD) of rhodium was investigated using rhodium(III) acetylacetonate and oxygen, and capacitance versus voltage is used to extract the effective work function in metal/insulator/semiconductor structures. Self-limiting growth was observed, and the resistivity of Rh deposited at 300 degrees C is similar to 10 mu Omega cm, approximately a factor of 2 larger than the Rh bulk resistivity (4.3 mu Omega cm). Selective area deposition is achieved using patterned resist layers, enabling capacitor fabrication without Rh etching. In the as-deposited state, the effective work function was measured to be 5.43 and 5.25 eV on SiO(2) and HfO(2) dielectrics, respectively. The ALD Rh films formed under conditions used likely contain residual oxygen which can affect oxygen vacancy creation and the effective work function at the metal/dielectric interface.

  • 出版日期2006-7-24