Importance of Bonding Atmosphere for Mechanical Reliability of Reactively Bonded Solder Joints

作者：Miyake Shugo; Ohtani Kohei; Inoue Shozo; Namazu Takahiro

来源：Journal of Engineering Materials and Technology-Transactions of the ASME, 2016, 138(1): 011006.

DOI：10.1115/1.4032020

<jats:p>Self-propagating exothermic reaction bonding (SERB) technique with Al/Ni multilayer film is fascinating in the viewpoint of lots of outstanding features, such as atmosphere-independent exothermic reaction and its self-propagation. The reactively bonded solder joints with high bonded strength are required for practical use in semiconductor devices. We have investigated the fracture strength of rectangular-solid specimens with reactively bonded solder joint (Sn–3.5Ag solder/reacted NiAl/Sn–3.5Ag solder) sandwiched by single crystal silicon (SCS). In this paper, the influence of bonding atmosphere on the fracture behavior is discussed by means of four-point bending testing and fracture surface observation. The fracture strength increases with increasing pressure load during bonding. The strength of the vacuum-bonded specimens is found to be higher than that of the air-bonded specimens. The fracture surface observation results suggest that Al oxide and intermetallic compounds (IMCs) formed at the reacted NiAl layer and the SnAg solder layer, respectively, would have affected the strength of the Al/Ni SERB joints.</jats:p>

• 出版日期2016-1