Miniaturized capillary pumped loop heat controlling system and it's manufacturing technique

作者：Chi, Yong^*; Tang, Yong; Chen, Jinchang; Deng, Xuexiong; Liu, Lin; Liu, Xiaokang; Wan, Zhenping

来源：Chinese Journal of Mechanical Engineering, 2007, 43(12): 166-170.

DOI：10.3901/JME.2007.12.166

• Finned micro-groove structure
• Integrated fin heat sink
• Miniaturized capillary pumped loop
• Ploughing-extrusion
• Skiving

In order to dissipate the high heat flux of micro electronic chips, a miniaturized capillary pumped loop (Miniaturized CPL) heat controlling system was developed and the techniques to manufacture this miniaturized CPL were introduced. A kind of finned micro-groove structure was manufactured by ploughing-extrusion and an integrated fin heat sink was manufactured by skiving. The capillary structure can be with the porous formed metal or the wire-mesh screen industrialized. The miniaturized CPL was composed of an evaporator, a condensator, a vapor line, a liquid line and working liquid. To increase its evaporation-condensation efficiency, a boiling enhancement structure of dimensional cross-connected micro-grooves with fins was implanted in the evaporator, and the condensator was composed of finned micro-groove structure and integrated fin heat sink. Using the phase-change heat transfer, the miniaturized CPL can be ensured under the capillary pumping function and the press of evaporating gas. Due to the resistance from capillary structure, the working liquid can run strictly along the single direction without extra mechanical pump or valve.

• 出版日期2007-12
• 单位华南理工大学