Dynamic Recrystallization Behavior of CuCrSnZnY Alloy

作者：Su Juanhua^*; Yang Zhe; Jia Shuguo; Ren Fengzhang

来源：Rare Metal Materials and Engineering, 2014, 43(1): 91-96.

• CuCrSnZnY alloy
• dynamic recrystallization
• deformation activation energy
• microhardness
• electric conductivity

The high temperature compression test of Cu-Cr0.5-Sn0.31-Zn0.15-Y0.054 alloy was carried out by Gleeble-1500D thermal simulation test machine. The strain rates were 0.01, 0.1, 1, 5 s(-1). The deformation temperatures were 600, 700, 800 degrees C. The maximum deformation degree was 0.6. The results show that the flow stress declines with deformation temperature rising. The flow stress increases with strain rate increasing. The hot compressive flow stress of the alloy has a noticeable peak stress at a low strain rate, 700 and 800 degrees C, and the continuous dynamic recrystallization characteristic is obvious. The thermal deformation activation energy (Q) and the flow stress equation are obtained by the correlation of flow stress, strain rate and temperature. The dynamic recrystallization microstructure of the alloy is influenced by the deformation conditions. The effect of deformation on the hardness and conductivity of the alloy after cooling are significant.

• 出版日期2014-1
• 单位河南大学