摘要

The mechanical properties of screen-printed silver circuit were focused by fabricating hybrid silver pastes composed of silver nanoparticles and micron-sized silver flakes with various contents of silver flakes (0, 25, 50, 75, 100 wt%). All printed hybrid silver circuits on the polyimide (PI) substrate were sintered at 250 degrees C for 30 min in air. Surface porosity and pore volume of hybrid silver were analyzed by SEM image analyzer and BET method, respectively. Pore volume was increased as contents of silver flake from 1.7 cm(3)/g to 3.0 cm(3)/g. The low cycle flexibility of screen-printed hybrid silver circuits was evaluated by Massachusetts Institute of Technology (MIT)-type folding endurance test to confirm the flexibility of screen-printed circuit. A roll-type 90 peel test was conducted to measure the peel strength of the hybrid silver circuits. The highest flexibility and peel strength of screen-printed silver circuit was 50 wt% of silver flake contents. Silver flake improved the peel strength and folding endurance property of the silver circuit screen-printed silver nanopastes.

  • 出版日期2017-3-30