A carbon fiber solder matrix composite for thermal management of microelectronic devices

作者：Murugesan, Murali; Zanden, Carl; Luo, Xin; Ye, Lilei; Jokubavicius, Valdas; Syvajarvi, Mikael; Liu, Johan^*

来源：Journal of Materials Chemistry C, 2014, 2(35): 7184-7187.

DOI：10.1039/c4tc00936c

• CONDUCTIVITY
• CARBONIZATION
• FABRICATION

A carbon fiber based tin-silver-copper alloy matrix composite (CF-TIM) was developed via electrospinning of a mesophase pitch with polyimide and carbonization at 1000 degrees C, followed by sputter coating with titanium and gold, and alloy infiltration. The carbonized fibers, in film form, showed a thermal conductivity of similar to 4 W m(-1) K-1 and the CF-TIM showed an anisotropic thermal conductivity of 41 +/- 2 W m(-1) K-1 in-plane and 20 +/- 3 W m(-1) K-1 through-plane. The thermal contact resistance of the CF-TIM was estimated to be below 1 K mm(2) W-1. The CF-TIM showed no reduction in effective through-plane thermal conductivity after 1000 temperature cycles, which indicates the potential use of CF-TIM in thermal management applications.

• 单位
  上海大学