A novel silver-aluminium high-temperature die attach nanopaste system: the effects of organic additives content on post-sintered attributes

作者：Manikam Vemal Raja; Razak Khairunisak Abdul; Cheong Kuan Yew^*

来源：Journal of Materials Science: Materials in Electronics , 2013, 24(8): 2678-2688.

DOI：10.1007/s10854-013-1155-9

An Ag-Al die attach material having a fixed Ag-Al nanoparticles weight percent content (80-20 %), as well as varying organic additives weight percent content was formulated. The total nanoparticle weight percent content was varied between 84.7 and 87.0 %. As the organic additives content in the Ag-80-Al-20 die attach material decreased from 15.3 to 13.0 %, the nanopaste%26apos;s viscosity increased. The die attach material was sintered at 380 A degrees C for 30 min to form Ag2Al and Ag3Al compounds. With decreasing organics content from 15.3 to 13.0 %, the porosity of the post-sintered samples also decreased from 30 to 19 %, while the density increased from 2.36 to 6.42 g/cm(3). The highest melting point was recorded for the sample with the least organic weight percent content at 519 A degrees C. The coefficient of thermal expansion and electrical conductivity values varied between 6.99-7.74 x 10(-6)/ A degrees C and 0.95-1.01 x 10(5) (ohm-cm)(-1) respectively with decreasing organic content from 15.3 to 13.0 %. The electrical conductivity values recorded were higher than or equal to that of most solder alloy die attach materials. By changing the organic additives content in the Ag-80-Al-20 die attach material, suitable properties are obtained for high temperature die attach applications.

• 出版日期2013-8