A coupled electromechanical analysis of a piezoelectric layer bonded to an elastic substrate: Part I, development of governing equations

作者:Zhang JQ*; Zhang BN; Fan JH
来源:International Journal of Solids and Structures, 2003, 40(24): 6781-6797.
DOI:10.1016/S0020-7683(03)00307-X

摘要

This two-part contribution presents a novel and efficient method to analyze the two-dimensional (2-D) electromechanical fields of a piezoelectric layer bonded to an elastic substrate, which takes into account the fully coupled electromechanical behavior. In Part I, Hellinger-Reissner variational principle for elasticity is extended to electromechanical problems of the bimaterial, and is utilized to obtain the governing equations for the problems concerned. The 2-D electromechanical field quantities in the piezoelectric layer are expanded in the thickness-coordinate with seven one-dimensional (1-D) unknown functions. Such an expansion satisfies exactly the mechanical equilibrium equations, Gauss law, the constitutive equations, two of the three displacement-strain relations as well as one of the two electric field-electric potential relations. For the substrate the fundamental solutions of a half-plane subjected to a vertical or horizontal concentrated force on the surface are used. Two differential equations and two singular integro-differential equations of four unknown functions, the axial force, N, the moment, M, the average and the first moment of electric displacement, D-0 and D-1, as well as the associated boundary conditions have been derived rigorously from the stationary conditions of Hellinger-Reissner variational functional. In contrast to the thin film/substrate theory that ignores the interfacial normal stress the present one can predict both the interfacial shear and normal stresses, the latter one is believed to control the delamination initiation.