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摘要
The thickness uniformity of thin film deposited by magnetron sputtering system with rotation and revolution was studied. The model of sputtering process is presented for this system. By combining substrate motion and coating process and using the model of partition of time step, three-dimension distribution images of the film thickness for this system with rectangle target are calculated, which are compared with the simulation results of the film thickness for non-revolution magnetron sputtering system. Research indicates that the thickness uniformity of the film is improved when the ratio of the rotation speed to the revolution speed is 0.5, and the conclusion is in good agreement with experimental results.
- 出版日期2010
- 单位电子科技大学
