A Multistep DRIE Process for Complex Terahertz Waveguide Components

作者：Jung Kubiak Cecile^*; Reck Theodore J; Siles Jose V; Lin Robert; Lee Choonsup; Gill John; Cooper Ken; Mehdi Imran; Chattopadhyay Goutam

来源：IEEE Transactions on Terahertz Science and Technology, 2016, 6(5): 690-695.

DOI：10.1109/TTHZ.2016.2593793

• Deep reactive-ion etching (DRIE)
• orthomode transducer (OMT)
• silicon dioxide (SiO2)
• silicon micromachining
• submillimeter waves
• terahertz (THz)

Asilicon deep reactive-ion etching (DRIE) process has been developed, using multiple SiO2 masks to enable multidepth waveguide features with +/- 2% tolerance. The unique capability of this process is demonstrated by designing, fabricating, and testing an orthomode transducer working in the 500-600 GHz frequency range. Straight waveguide measurements are also performed to characterize the losses associated with the multistep DRIE process, giving results slightly better than expected for metal-machined waveguides. This process enables the integration of multiple terahertz waveguide components such as mixers, multipliers, quadrature hybrids, and polarization twists onto a single silicon package.

• 出版日期2016-9