Agglomeration and diffusion in Cu thin films under supercritical CO2 annealing

作者：Nakamura Yoshiki^*; Watanabe Mitsuhiro; Kondoh Eiichi

来源：Japanese Journal of Applied Physics, 2015, 54(5): 05EA03.

DOI：10.7567/JJAP.54.05EA03

This paper deals with Cu agglomeration and diffusion that occur in Cu thin films during annealing in supercritical CO2. Cu was deposited by using direct current magnetron sputtering on trench-patterned substrates. Annealing was performed in different atmospheres, namely, pure CO2, CO2 mixed with H-2, CO2 mixed with hexafluoroacetylacetone (Hhfac), and CO2 mixed with H-2 and Hhfac. The conspicuous agglomeration of Cu films was observed after annealing in the H-2-mixed supercritical CO2. This is because Cu diffusion is accelerated by reduction and oxidation that proceed simultaneously on the Cu surface.

• 出版日期2015-5