Drilling of Through Holes in Sapphire Using Femto-second Laser Pulses

作者:Mishchik Konstantin*; Gaudfrin Kevin; Lopez John
来源:Journal of Laser Micro Nanoengineering, 2017, 12(3): 321-324.
DOI:10.2961/jlmn.2017.03.0024

摘要

We have studied a bottom-up ablation drilling with infrared femtosecond laser pulses. To avoid dust deposition inside the hole, we have investigated the role of focusing and scanning parameters, during the bottom-up ablation. The numerical aperture and pulse-to-pulse overlap were considered to determine an optimal ablation regime for each layer. Using these focusing conditions, a multiparametric study of laser fluence and vertical translation of focal spot was performed to determine conditions for efficient in-process dust removal. Drilling sapphire at these optimal parameters produces crack-free, chip-free, and low-tapered (< 3 degrees) holes. We demonstrated that these parameters can be used for scaling the process for repetition rates of 1MHz and higher.

  • 出版日期2017-12
  • 单位中国地震局