Numerical Solution for Accurate Bondwire Modeling

作者：Xue Hao^*; Benedik Christopher R; Zhang Xiaomeng; Li Shuo; Ren Saiyu

来源：IEEE Transactions on Semiconductor Manufacturing, 2018, 31(2): 258-265.

DOI：10.1109/TSM.2018.2818168

• Bondwire model
• electronics packaging
• integrated circuit packaging
• radio frequency integrated circuit
• scattering parameters

This paper presents a method of modeling bondwires of arbitrary shapes using lumped element models. As an example, a semi-circular multi-wire configuration is presented. Effects of wire angles and dielectric thicknesses are taken into account. A fixture containing three- and five-wire networks is fabricated, assembled, and tested with a vector network analyzer which extracts the S-parameters of each two-port network. These measurements are compared to the proposed model and two benchmark models from a widely used design software package. As a comparison, mean absolute error and root mean square error are used to analyze results showing that the proposed model is better at tracking the measured physical data compared to the two benchmark models. Although semicircular bondwires is presented as an example, any geometry is supported using the proposed model. As an illustration of the easy-use of this proposed bondwire model in a system design, the performance of a high-frequency amplifier is given with and without the bondwire model. The results clearly demonstrate the compatibility of the model with widely used circuit simulators and the importance of including the effects of bondwires when determining circuit performance.

• 出版日期2018-5