Fault-tolerant method of critical communication components in 3D NoC:A review

作者：Ouyang, Yi Ming; Sun, Cheng Long; Chen, Qi; Liang, Hua Guo; Yi, Mao Xiang; Huang, Zheng Feng; Yan, Ai Bin

来源：Acta Electronica Sinica, 2016, 44(12): 3053-3063.

DOI：10.3969/j.issn.0372-2112.2016.12.034

• Communication architectures
• Communication components
• Efficient communications
• Fault-tolerant
• Future research directions
• High integration density
• Situation at home and abroad
• Through-Silicon-Via

3D NoC stacking the multi-chips with TSV has many advantages, such as high integration density and high communication efficiency. It is the mainstream of communication architecture on multi-core on-chip systems. However, due to the process variation, physical defects and low yield of TSV, 3D NoC is facing serious fault problems. It is essential to design a fault-tolerant mechanism for 3D NoC to ensure the efficiency of communication. In this paper, we focus on the failure and fault-tolerance issues of the critical communication components (routers and TSVs) in 3D NoC. From the description of fault-tolerance necessity, researches situation at home and abroad, future research directions, key issues and the proposed solutions, we conduct an in-depth discussion. Thus, we provide integrated solutions for improving the reliability of NoC and ensuring efficient communication system.

• 出版日期2016
• 单位合肥工业大学