科研之友
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摘要
In this paper, a novel method to achieve through-via interconnection using Aerosol Jet technology is proposed. Compared with the conventional MEMS through-via metallization e.g., coating with shadow mask or electroforming, the Aerosol process is (1) Adapt to extremely confined geometries of via, (2) Save material due to depositing on demand, (3) Allow to pattern the extraction electrode without mask. To demonstrate the method, printed Ag on doped silicon sintering from 200 to 500 A degrees C is prepared and evaluated by testing which reveals a sufficient specific contact resistance. Besides, as the SEM cross sections show, metal layer is with good coverage for trapezium or even reverse trapezium via using the Aerosol Jet. However, the printed Ag is vulnerable to thermal shock and prone to crack after sintering. The corresponding cracks, resulting from residual tensile stress caused by the difference of thermal expansion coefficients, can be greatly eliminated by naturally cooling down.
- 出版日期2015-2
- 单位厦门大学
