科研之友
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摘要
Quality control of microchemical products is based on the inspection of surface topography, film thickness and other optical constants. Especially for lab-on-chip applications, there is a strong demand for concurrent metrology and passive layer thickness observation. Chromatic confocal microscopy is a common method to reconstruct surface topographies, while thin film reflectometry is a technique for measuring film thicknesses. In this work, we present a combination of these two established techniques, simultaneously determining topography and film thickness. The proposed spectrometric measuring system captures confocal and thin film signals from a given sample. The extracted signals are analyzed according to a given model by a least-squares estimator in order to extract the parameters of interest. Finally, the sample's film thickness and topography are locally determined at the same time and with high precision. By scanning the sample surface laterally, both the surface topography and its film thickness can be reconstructed. The presented measurements performed at a test object exhibit excellent performance of the method.
- 出版日期2010-12
