A review of passive thermal management of LED module

作者:Ye Huaiyu*; Sau Koh; Van Zeijl Henk; Gielen A W J; Zhang Guoqi
来源:Chinese Journal of Semiconductors, 2011, 32(1): 014008.
DOI:10.1088/1674-4926/32/1/014008

摘要

Recently, the high-brightness LEDs have begun to be designed for illumination application. The increased electrical currents used to drive LEDs lead to thermal issues. Thermal management for LED module is a key design parameter as high operation temperature directly affects their maximum light output, quality, reliability and life time. In this review, only passive thermal solutions used on LED module will be studied. Moreover, new thermal interface materials and passive thermal solutions applied on electronic equipments are discussed which have high potential to enhance the thermal performance of LED Module.

  • 出版日期2011