Stress evolution in the metal layers of TSVs with Bosch scallops

作者：Singulani A P^*; Ceric H; Selberherr S

来源：Microelectronics Reliability, 2013, 53(9-11): 1602-1605.

DOI：10.1016/j.microrel.2013.07.132

We have studied the stress evolution in the tungsten film of a particular open TSV technology during the thermal processing cycle. The film is attached to the via%26apos;s wall, where scallops were observed as a result of the Bosch processing. Our work describes a scheme which considers the scallops on the TSV and conjugates a stress model for thin-films with the traditional mechanical FEM approach. The results reveal potential reliability issues and a specific evolution of the stress in the tungsten layer.

• 出版日期2013-11