Low-Contact Resistance Probe Card Using MEMS Technology

作者：Kandalaft Nabeeh^*; Basith Iftekhar Ibne; Rashidzadeh Rashid

来源：IEEE Transactions on Instrumentation and Measurement, 2014, 63(12): 2882-2889.

DOI：10.1109/TIM.2014.2321461

• Automatic test equipment
• design-for-testing
• manufacturing test
• MEMS probe
• signal integrity
• wafer probe card

Multichannel die probing increases test speed and lowers the overall cost of testing. A new high-density wafer probe card based on MEMS technology is presented in this paper. MEMS-based microtest-channels have been designed to establish high-speed low-resistance connectivity between the die-under-test and the tester at the wafer level. The proposed test scheme can be used to probe fine pitch pads and interconnects of a new generation of 3-D integrated circuits. The proposed MEMS probe, which is fabricated with two masks, supports 106 lifetime touchdowns. Measurement results using a prototype indicate that the proposed architecture can be used to conduct manufacturing tests up to 38.6 GHz with less than -1-dB insertion loss while maintaining 11.4-m Omega contact resistance. The measured return loss of the probe at 39.6 GHz is -12.05 dB.

• 出版日期2014-12