Adhesive strength of CVD diamond thin films quantitatively measured by means of the bulge and blister test

作者：Xiang, Daohui^*; Chen, Ming; Ma, Yuping; Sun, Fanghong

来源：Journal of University of Science and Technology Beijing, 2008, 15(4): 474-479.

DOI：10.1016/S1005-8850(08)60089-4

• diamond thin films
• adhesive strength
• chemical vapor deposition (CVD)
• elastic modulus

Large advancement has been made in understanding the nucleation and growth of chemical vapor deposition (CVD) diamond, but the adhesion of CVD diamond to substrates is poor and there is no good method for quantitative evaluation of the adhesive strength. The blister test is a potentially powerful tool for characterizing the mechanical properties of diamond films. In this test, pressure was applied on a thin membrane and the out-of-plane deflection of the membrane center was measured. The Young's modulus, residual stress, and adhesive strength were simultaneously determined using the load-deflection behavior of a membrane. The free-standing window sample of diamond thin films was fabricated by means of photolithography and anisotropic wet etching. The research indicates that the adhesive strength of diamond thin films is 4.28 /- 0.37 J/m(2). This method uses a simple apparatus, and the fabrication of samples is very easy.

• 出版日期2008-8
• 单位上海交通大学; 河南理工大学