A paradigm of carbon nanotube interconnects in microelectronic packaging

作者：Sun Yangyang^*; Zhu Lingbo; Jiang Hongjin; Lu Jiongxin; Wang Wei; Wong C P

来源：Journal of Electronic Materials, 2008, 37(11): 1691-1697.

DOI：10.1007/s11664-008-0533-1

• carbon nanotubes
• transfer
• interconnect
• ohmic contact

Carbon nanotube (CNT) arrays/films were transferred onto copper substrates via eutectic tin/lead (SnPb) solder pastes. The morphologies, thermal stabilities, adhesion to substrates, and electrical properties of the as-transferred CNT arrays were studied. The CNT arrays generated negligible expansion or contraction below 250 degrees C. The adhesion of CNT arrays to the substrate was significantly improved by the transfer process. An ohmic contact was formed between the transferred CNT arrays and the Sn-Pb solder. Four-probe electrical measurements yielded the resistance of the as-transferred CNT films under the electrode to be around 0.0056 Omega, from which the resistivity of each individual CNT tube was calculated to be 2.44 x 10(-4) Omega cm.

• 出版日期2008-11