A liquid metal cooling system for the thermal management of high power LEDs

作者:Deng, Yueguang; Liu, Jing*
来源:International Communications in Heat and Mass Transfer, 2010, 37(7): 788-791.
DOI:10.1016/j.icheatmasstransfer.2010.04.011

摘要

An active cooling solution using liquid metal as the coolant was proposed for high power light emitting diodes (LEDs). The typical thermal-physical properties of liquid metal were presented. Then a series of experiments under different operation conditions were performed to evaluate the heat dissipation performance of the liquid metal cooling system, and the results were compared with that of water. In order to better understand the cooling capability of liquid metal cooling system, a theoretical thermal resistance model was established and discussed. Both the experiments and theoretical analysis indicated that liquid metal cooling was a powerful way for heat dissipation of high power LEDs, and the fabrication of practical liquid metal cooling devices was feasible and useful.