A Study of Combining Molecular Statics with Heat Transfer Finite Difference Method for Nanoscale Orthogonal Cutting of Copper

作者：Lin Zone Ching^*; Hsu Ying Chih

来源：Journal of the Chinese Society of Mechanical Engineers, 2012, 33(2): 91-102.

• molecular statics
• Nanoscale cutting
• Finite difference
• Temperature
• copper

This paper uses three-dimensional quasi-steady molecular statics model and diamond tool to carry out simulation of nanoscale orthogonal cutting of a single-crystal copper workpiece. Based on the simulation results, this paper analyzes its cutting force, equivalent stress and strain, and the temperature field distribution of workpiece. This paper supposes that the temperature rise of workpiece is mainly caused by two heat sources: plastic deformation heat and friction heat. Therefore, this paper uses the equivalent stress and strain calculated from quasi-steady molecular statics simulation, and further calculates the plastic deformation heat. Then, this paper develops a theoretical model about production of friction heat at the workpiece atoms on the tool face. After the increased temperature produced by these two heat sources are added up, the acquired total temperature rise at each atom of the workpiece is substituted in heat transfer finite difference equation to carry out heat transfer. Using this method, this paper calculates the temperature field of the nanoscale orthogonal cutting of copper workpiece in each step and makes related analysis.

• 出版日期2012-4