摘要

A monolayer diamond grinding wheel was fabricated by brazing in vacuum. The wheel was then used to grind alumina at three different grinding speeds. The horizontal and vertical grinding forces, and the grinding temperatures were measured during grinding. SEM observations were made for the ground workpiece surfaces. The influences of the peripheral wheel speed on the grinding forces, specific grinding energy and grinding temperatures were analyzed under different combinations of depth of cut and workpiece velocity. The dependence of the average grinding force per grain and specific grinding energy on the maximum undeformed chip thickness was discussed respectively. It was found that an increase in the peripheral wheel speed reduced grinding force, but increased force ratio, specific grinding energy, and grinding temperature.