Microstructure and chemical characterization of the intermetallic phases in Cu/(Sn,Ni) diffusion couples with various Ni additions

作者：Wierzbicka Miernik Anna^*; Miernik Krzysztof; Wojewoda Budka Joanna; Litynska Dobrzynska Lidia; Garzel Grzegorz

来源：Intermetallics, 2015, 59: 23-31.

DOI：10.1016/j.intermet.2014.12.001

• Intermetallics
• Joining
• Microstructure
• Electron microscopy, scanning
• Electron microscopy, transmission

The paper presents new results concerning the influence of nickel addition (1 and 5 at.%) into tin on the development of the Cu/(Sn,Ni) interface area in diffusion couple experiment. The morphology and chemical composition of the intermetallic phases growing in the Cu/(Sn,Ni) diffusion couples were examined by means of the scanning (SEM) and transmission (TEM) electron microscopy after annealing at 215 degrees C in vacuum for different period time.
It was shown that even 1 at.% of nickel addition into tin resulted in formation of intermetallics of complex microstructure. The presence of (Cu1-xNix)(6)Sn-5 in two morphological and compositional variants was noted. The discontinuous layer consisting up to 7.2 at.% of Ni closer to copper end-member coexisted with needle-like and faceted precipitates with even 22.3 at.% of Ni, which intensively detached from the interface. At the Cu/(Cu1-xNix)(6)Sn-5 interface the formation of Cu3Sn wavy layer compound was observed in all examined diffusion couples which became thicker with time. The porosity within the both formed intermetallic phases existed irrespective of the amount of added nickel.

• 出版日期2015-4