A study of the relationship between stick-slip and micro-scratches generation during chemical-mechanical polishing process

作者：Jung Soyoung; Yang Woo Yul; Sung In Ha^*

来源：Journal of Mechanical Science and Technology, 2013, 27(10): 3011-3015.

DOI：10.1007/s12206-013-0818-z

• Chemical-mechanical polishing (CMP)
• Finite element analysis (FEA)
• Micro-scratches
• Stick-slip behavior

An observation on the relationship between stick-slip phenomena and chatter scratch generation during chemical-mechanical polishing (CMP) was made using finite element analysis. The motivation for this work is based on the questions about the possibility of the stick-slip phenomena in the CMP process and the quantitative relation between the stick-slip behaviors and the formation characteristics of the scratch. The finite element simulation results showed that stick-slip friction could occur during CMP and it could be seen only in the case of the interactions with the particles trapped inside pad surface. Also, the stick-slip period increased with the density of interacting wafer surface material and the particle size had a significant effect on the stick-slip period and magnitude. It is expected that this work will aid the development of chatter scratch reduction technology.

• 出版日期2013-10