摘要
The present work aimed to evaluate the performances of Cu, Zn and Ni dissolution from Waste printed circuit boards (WPCBs) obtained from mobile phones (MP) using different solid: liquid ratios (SLR) and oxidant concentration (C-ox). It was found that the increase of C-ox at constant SLR increases more the performances of Zn and Ni dissolution than it does for Cu. In contrast, the increase of SLR from 1: 5 to 1: 15 at constant C-ox diminished the dissolution efficiency of Ni by 79 %, of Zn with 55 % and in the case Cu by 22 %. The experimental results revealed that the most favorable conditions for the dissolution of Zn, Ni and Cu are provided at the SLR of 1: 5 and 0.42 M Na2S2O8.
- 出版日期2015-9