Analysis of thermal expansion in elastic and elastoplastic layers subjected to cyclic thermal loading

作者：Wada K^*; Yagi Y; Nakagawa I; Atsumi T; Ohno N

来源：Microelectronics Reliability, 2010, 50(9-11): 1626-1630.

DOI：10.1016/j.microrel.2010.07.012

Thermal expansion of a Cu/Si(3)N(4)/Cu layered structure was studied by actual measurement and finite element analysis. Thicker Cu and subjecting the samples to cyclic thermal loading increase the thermal expansion of the layered structure. Strain-controlled cyclic tension/compression tests in Cu were performed to obtain the characteristics of cyclic plasticity. A multi-linear kinematic hardening model was applied to represent the elastoplasticity of Cu. Two sets of material parameters were determined: One set from the initial and a second set from the stabilized stress-strain relationship, respectively. It was demonstrated that the determined material parameters allow accurate prediction of the thermal expansion coefficient within 1 ppm/degrees C for structures subjected and non-subjected to cyclic thermal loading.

• 出版日期2010-11