科研之友
微信
新浪微博
Facebook
分享链接
摘要
In this article, the authors report a new lift-off process to obtain nanoporous free-standing trilayer film of metal/photoresist/antireflective coating (ARC) stack and to reuse the thin and flexible membrane as a versatile stencil lithography mask for the dual purposes. For the initial lift-off process of metal nanostructures, nanoperiodic pore patterns of the photoresist/ARC bilayer were first defined by holographic lithography and reactive ion etching on a silicon substrate. Then a thin metal layer was deposited through the nanopores, forming the uniform array of metal nanostructures on the silicon substrate. Different from a traditional lift-off process, the by-product of the metal/photoresist/ARC trilayer was not dissolved away but released intact from the substrate as a freestanding membrane by using a specially designed solution (NH3/H2O2/H2O). It uniquely allows the use of the free-standing membrane as a novel stencil for direct bonding and continuous release onto/from various new substrates, including flexible substrates such as polydimethylsiloxane, due to good mechanical properties of the soft membrane. Such advantages also provide enhanced capability and accuracy of the pattern transfer in stencil lithography with greater simplicity.
- 出版日期2012-11
