A high-speed low-voltage double-switch optical crossconnect using stress-induced bending, micromirrors

作者：Kuo JN^*; Lee GB; Pan WF

来源：IEEE Photonics Technology Letters, 2004, 16(9): 2042-2044.

DOI：10.1109/LPT.2004.831544

• microelectromechanical systems (MEMS)
• micromirror
• optical crossconnect (OXC)
• stress-induced beam

A high-speed low-voltage double-switch electrostatically actuated optical crossconnect (OXC) is demonstrated using stress-induced bending micromirrors. A curved polysilicon seesaw structure substantially lowers the electrostatic operating voltage of the OXC and provides a double-switch option. Large mirror deflection angles of 13degrees (mirror elevation of 290 mum high) and 5degrees (cantilever deflection of 90 mum high), corresponding to low operating voltages of 25 and 18 V, could be obtained. A submillisecond switching time (<850 mus), a low optical insertion loss (0.65 dB), and a small polarization-dependent loss (<0.08 dB) are achieved.

• 出版日期2004-9