Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory

作者：Kim Do Hyun; Yoo Hyeon Gyun; Hong Sung Min; Jang Bongkyun; Park Dae Yong; Joe Daniel J; Kim Jae Hyun^*; Lee Keon Jae^*

来源：Advanced Materials, 2016, 28(38): 8371-8378.

DOI：10.1002/adma.201602339

• flexible ACF packaging
• flexible NAND flash memory
• roll-to-plate technology
• ultrathin silicon-based flexible electronics

Ultrathin silicon-based flexible 16 x 16 NAND flash memory (f-NAND) is demonstrated utilizing roll-to-plate packaging. The roll-based thermo-compression bonding of the anisotropic conductive film (ACF) transfers and simultaneously interconnects the f-NAND on a flexible printed circuit board. Reliable circuitry operation of the 16 x 16 f-NAND is confirmed with excellent flexibility and stable ACF interconnections.

• 出版日期2016-10-12