A comparison of some imidazoles in the curing of epoxy resin

作者：Ham Young Rok; Kim Sun Hee; Shin Young Jae; Lee Dong Ho; Yang Minhee; Min Ji Hye; Shin Jae Sup^*

来源：Journal of Industrial and Engineering Chemistry, 2010, 16(4): 556-559.

DOI：10.1016/j.jiec.2010.03.022

An epoxy-imidazole resin system was used to form an anisotropic conducting film (ACF) for electronic equipment applications. In this study, the curing behaviors of an epoxy resin with imidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-methylimidazole, 2-ethy1-4(5)-methylimidazole, and 1-(2-cyanoethyl)-2-ethy1-4(5)-methylimidazole were investigated using differential scanning calorimetry (DSC), and the curing times were determined at 150 and 180 degrees C. The polymerization mechanism for the epoxy resin with imidazoles was examined, and the DSC results matched the mechanism. 2-Methylimidazole exhibited the fastest reaction time among the imidazoles used in this study.

• 出版日期2010-7-25