Modification of Sn-1.0Ag-0.5Cu solder using nickel and boron

作者：Qu Jun Feng^*; Xu Jun; Hu Qiang; Zhang Fu Wen; Zhang Shao Ming

来源：Rare Metals, 2015, 34(11): 783-788.

DOI：10.1007/s12598-014-0221-7

• Lead-free solder
• Sn-1.0Ag-0.5Cu
• Interfacial reaction
• B addition
• Intermetallic compound

Effects of Ni and B additions on the microstructure and growth behavior of the intermetallic compound (IMC) of Sn-1.0Ag-0.5Cu alloys (SAC105) were investigated in this study. Results show that microadditions of Ni and B result in volume fraction of primary Sn increasing and the grain size decreasing observably. It is found that a large number of fine reinforcement particles with network-like shape are found in the solder, and the thickness of interfacial IMC layer in the solder joint is grew less than that of SAC105 with longer aging time. Shear test results reveal that as-soldered solder joints of microalloyed SAC105 have better shear strength than that of SAC105 solder alloy.

• 出版日期2015-11
• 单位北京有色金属研究总院