摘要

<正>An 88 nm gate-length In0.53Ga0.47As/In0.52Al0.48As InP-based high electron mobility transistor (HEMT) was successfully fabricated with a gate width of 2×50μm and source-drain space of 2.4μm.The T-gate was defined by electron beam lithography in a trilayer of PMMA/A1/UⅧ.The exposure dose and the development time were optimized,and followed by an appropriate residual resist removal process.These devices also demonstrated excellent DC and RF characteristics:the extrinsic maximum transconductance,the full channel current, the threshold voltage,the current gain cutoff frequency and the maximum oscillation frequency of the HEMTs were 765 mS/mm,591 mA/mm,-0.5 V,150 GHz and 201 GHz,respectively.The HEMTs are promising for use in millimeter-wave integrated circuits.

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