摘要

An epoxy-based precursor polymer was prepared from the diglycidyl. ether of Bisphenol A and aniline. The precursor polymer was doped with a certain amount of cross-linking agent M20S to obtain a thermal-curable polymeric system BPAN + M20S. The thermal curing behavior of BPAN + M20S was studied by means of in-situ infrared spectroscopy and it was found that BPAN + M20S showed significant thermal- curability and had the similar curing dynamics at both 120degreesC and 180degreesC. The curing degree can reach 70. 7 % at 120degreesC and 81. 8 % at 180degreesC within 20 min, respectively. When a two-layer film was prepared with the cured polymer BPAN + M20S as the bottom cladding and an E. O. polymer BPAN-1 A-NT as the upper layer, SEM studies showed a perfect interface between the bottom and the upper layers of the two-layer film and the surface of the upper layer was quite smooth. A polymeric planar prototype waveguide,which was fabricated based on the above two-layer film and covered by another layer of UV photoresist, showed good wave-guide performance.