A Transient Electrothermal Analysis of Three-Dimensional Integrated Circuits

作者：Harris T Robert^*; Priyadarshi Shivam; Melamed Samson; Ortega Carlos; Manohar Rajit; Dooley Steven R; Kriplani Nikhil M; Davis W Rhett; Franzon Paul D; Steer Michael B

来源：IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2(4): 660-667.

DOI：10.1109/TCPMT.2011.2178414

• 3DIC
• electrothermal effects
• thermal management
• transient analysis

A transient electrothermal simulation of a 3-D integrated circuit (3DIC) is reported that uses dynamic modeling of the thermal network and hierarchical electrothermal simulation. This is a practical alternative to full transistor electrothermal simulations that are computationally prohibitive. Simulations are compared to measurements for a token-generating asynchronous 3DIC clocking at a maximum frequency of 1 GHz. The electrical network is based on computationally efficient electrothermal macromodels of standard and custom cells. These are linked in a physically consistent manner with a detailed thermal network extracted from an OpenAccess layout file. Coupled with model-order reduction techniques, hierarchical dynamic electrothermal simulation of large 3DICs is shown to be tractable, yielding spatial and temporal selected transistor-level thermal profiles.

• 出版日期2012-4