摘要
A nano-scale three-dimensional (3D) Ni mold fabrication technique was developed for nanoimprint lithography by filling Ni into a patterned polymer resist film, 100nm in width and with an aspect ratio of 1. This was achieved by a combination of two supercritical fluid-based technologies: supercritical fluid impregnation (SCFI) of Pd and supercritical fluid deposition (SCFD) of Ni. Pd nanoparticles were formed primarily on the surface of the 3D patterned resist film by SCFI to provide a catalytic effect on the resist surface, which initiated the subsequent Ni-SCFD. Ni was then filled into the patterned resist by SCFD, exploiting its superior gap-filling capabilities. Our proposed scheme has the potential to be applied to structures scaled down to below 100 nm.
- 出版日期2015-7