科研之友
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摘要
Highly scaled technologies at and beyond the 22-nm node are sensitive to various scaling-related problems that make integrated circuits and systems less reliable. Employing a cross-layer approach spreads the burden of ensuring resilience across multiple levels of the design hierarchy. This article illustrates a methodology for dealing with scaling-related problems via two case studies that link models of low-level technology-related problems to system behavior.
- 出版日期2013-8
