A modified Damascene electrodeposition process for bottom-up filling of recessed surface features

作者：Lee Chang Hwa; Moffat Thomas P^*

来源：Electrochimica Acta, 2010, 55(28): 8527-8531.

DOI：10.1016/j.electacta.2010.07.045

• Damascene process
• Nickel
• Superconformal deposition
• Bottom up filling
• Mercaptobenzimidazole

A modification of the conventional Damascene metallization process is described whereby selective removal of the thin wetting/seed layer horn the sidewalls and free surfaces enables selective nucleation and bottom-up electrodeposition of metals and alloys in recessed sui face features The process is demonstrated by filling sub-micrometer trenches with electrodeposited Ni A conventional PVD Cu seed layer is etched to remove Cu from the sidewalls and free surface while leaving a continuous Cu wetting layer intact on the trench bottom The underlying non-wetting barrier layer provides a conductive path for electrodeposition from contacts on the perimeter of the work piece to the trench bottom The robustness of the bottom-up Ni electrodeposition process is greatly increased by the addition of 2-mercaptobenzimidazole (MBI) to the plating bath The additive hinders spurious nucleation of Ni on residual Cu patches that may remain on the free sui face Published by Elsevier Ltd

• 出版日期2010-12-1