摘要

Highly photosensitive Si film of new structure was successfully fabricated using semiconductor blue laser diode annealing (BLDA). By adopting back-reflection layer, simulation results show 86% increase of light absorption in red or IR region. Peaks from XRD results showed that Si film was crystallized clearly after BLDA in spite of the new back-reflection layer of Ti. All the process for photoconductive film was conducted using r.f. sputtering and vacuum evaporation without adopting CVD. After H-2 annealing, photoconductivity for the patterned Si films of 50 nm thickness increased remarkably up from 1.2 x 10(-4) to 3.2 x 10(-1) S/cm under white light of 100 mW/cm(2). Adopting back-reflection layer under the crystallized Si film using BLDA is promising to integrate functional photosensors with TFTs on panel.

  • 出版日期2016-3

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