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摘要
Using combined experimental and simulation techniques, this study addresses the critical stress for peeling off crucial layer(s) in multilayered epitaxial functional thin films on n-Si(001) substrate. The thickness of platinum (Pt) and PZT thin films was varied from 22 nm to 142 nm and 90 nm to 450 nm, respectively. Residual stresses were measured by analyzing captured fringes using Newton's rings technique. Advanced finite element computation was next conducted to predict the evolution of residual stresses. Induced stresses in Pt thin film were found to be decreased with decreasing the thickness of film from 72 nm to 40 nm. In contrast, stresses are shown to be decreased with increasing the thickness of PZT film from 240 nm to 450 nm. The design of the pyroelectric multilayered sensors was thus optimized employing finite element (FE) simulation. Computed stresses were found to correlate well with that observed in experiments. FE simulations can thus be used as a tool to a priori predict the evolution of residual stresses, which may allow a fail-safe design before the fabrication of pyroelectric image sensors.
- 出版日期2015-7
