科研之友
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摘要
A method of preparing three-dimensional copper cellular architecture by multiple-step electrodeposition without any polymer framework is reported in this article. Simultaneously, the physical properties and strengthening mechanism of this material in the second electrodeposition was also investigated by means of scanning electron microscopy, mechanical testing, and linear sweep voltammetry. During this process, a series of positive internal structural changes occurred inside the first deposited copper foam, which led to the improvement of mechanical strength and bonding force with the substrate.
